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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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NIS3001 Fiches technique(PDF) 1 Page - ON Semiconductor |
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NIS3001 Fiches technique(HTML) 1 Page - ON Semiconductor |
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1 / 18 page  © Semiconductor Components Industries, LLC, 2003 October, 2003 − Rev. 5 1 Publication Order Number: NIS3001/D NIS3001 Integrated Driver and MOSFET Power Chip for Synchronous Buck Controllers The NIS3001 is an integrated multi−chip solution for high power DC to DC synchronous buck converters. It contains two power MOSFETs that are controlled by an internal Driver. All three die are packaged in a power QFN package called PInPAK ™. The 10.5 by 10.5 mm PInPAK ™ package increases power density and simplifies PCB layout. The device can be used in single or multi−phase applications. The NIS3001 implements the newest MOSFET technology. The control MOSFET is designed to provide improved switching performance and operates at a much lower temperature compared to discrete solutions. The synchronous MOSFET is designed to reduce conduction and switching losses at high frequencies. The integrated solution greatly reduces the parasitic inductance associated with conventional discrete buck converters and results in the highest power conversion efficiency. The power density of the NIS3001 is optimized based on MOSFET die size and PInPAK design. The PInPAK layout allows for direct routing into each power terminal. This results in a better thermal solution for the system. In addition its thermal resistance is 50% lower than BGAs. In summary, the NIS3001 has an improved efficiency, reliability and scalability for multi−phase synchronous buck converters. Features • Matched MOSFETs for Optimal Efficiency • 10.5 mm x 10.5 mm Power QFN Package, PInPAK • 25 A DC Output Current • 7.0 to 14 V Input Voltage Range • Internal Thermal Shutdown • Operating Frequency Range up to 1,000 kHz • 0.7 V to 5.1 V Output Voltage Range • Nominal Duty−Cycle 5% to 50% Hi Side Discrete FETs Lo Side Discrete FETs Figure 1. VS VIN DRN PGND Analog Driver IC CASE 500 PInPAK 10.5x10.5 PLLP http://onsemi.com Device Package Shipping† ORDERING INFORMATION NIS3001QPT1 PInPAK 1500/Tape & Reel NIS3001 = Specific Device Code A = Assembly Site WL = Wafer Lot YY = Year WW = Work Week MARKING DIAGRAM NIS3001QP AWLYYWW (Bottom View) 11 12 13 10 7 98 5 6 1 2 3 4 14 16 18 19 15 17 20 21 PINOUT DIAGRAM †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. |
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