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NCV47701 Fiches technique(PDF) 3 Page - ON Semiconductor |
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NCV47701 Fiches technique(HTML) 3 Page - ON Semiconductor |
3 / 12 page NCV47701 www.onsemi.com 3 ABSOLUTE MAXIMUM RATINGS (Note 1) Rating Symbol Min Max Unit Input Voltage Vin −42 45 V Enable Input Voltage VEN −42 45 V Adjustable Input Voltage VADJ −0.3 10 V CSO Voltage VCSO −0.3 7 V Output Voltage Vout −1 40 V Junction Temperature TJ −40 150 °C Storage Temperature TSTG −55 150 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. ESD CAPABILITY (Note 2) Rating Symbol Min Max Unit ESD Capability, Human Body Model ESDHBM −2 2 kV ESD Capability, Machine Model ESDMM −200 200 V 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC−Q100−002 (JS−001−2010) ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115) Field Induced Charge Device Model ESD characterization is not performed on plastic molded packages with body sizes < 50mm2 due to the inability of a small package body to acquire and retain enough charge to meet the minimum CDM discharge current waveform characteristic defined in JEDEC JS−002−2014. LEAD SOLDERING TEMPERATURE AND MSL (Note 3) Rating Symbol Min Max Unit Moisture Sensitivity Level SOIC−8 EP SOIC−8 MSL 2 1 − 3. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D THERMAL CHARACTERISTICS Rating Symbol Value Unit Thermal Characteristics, SOIC−8 EP (single layer PCB) Thermal Resistance, Junction−to−Air (Note 4) Thermal Reference, Junction−to−Lead (Note 4) RθJA RψJL 70 19 °C/W Thermal Characteristics, SOIC−8 EP (4 layers PCB) Thermal Resistance, Junction−to−Air (Note 4) Thermal Reference, Junction−to−Lead (Note 4) RθJA RψJL 29 12 °C/W Thermal Characteristics, SOIC−8 (single layer PCB) Thermal Resistance, Junction−to−Air (Note 4) Thermal Reference, Junction−to−Lead (Note 4) RθJA RψJL 121 42 °C/W Thermal Characteristics, SOIC−8 (4 layers PCB) Thermal Resistance, Junction−to−Air (Note 4) Thermal Reference, Junction−to−Lead (Note 4) RθJA RψJL 77 52 °C/W 4. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate. Single layer − according to JEDEC51.3, 4 layers − according to JEDEC51.7. RECOMMENDED OPERATING RANGES Rating Symbol Min Max Unit Input Voltage (Note 5) Vin 5.5 40 V Output Current Limit (Note 6) ILIM 10 350 mA Junction Temperature TJ −40 150 °C Nominal Output Voltage Vout_nom 5.0 20 V Current Sense Output (CSO) Capacitor CCSO 1.0 4.7 mF Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 5. Minimum Vin = 5.5 V or (Vout_nom + 0.5 V), whichever is higher. 6. Corresponding RCSO is in range from 25 kW down to 728 W. |
Numéro de pièce similaire - NCV47701_17 |
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Description similaire - NCV47701_17 |
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