NCV47700

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11

PACKAGE DIMENSIONS

SOIC−8 EP

CASE 751AC

ISSUE C

NOTES:

1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS

3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.

ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.004mm IN

EXCESS OF MAXIMUM MATERIAL CONDITION.

4. DIMENSION D DOES NOT INCLUDE MOLD FLASH, PROTRU-

SIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR

GATE BURRS SHALL NOT EXCEED 0.006mm PER SIDE.

DIMENSION E1 DOES NOT INCLUDE INTERLEAD FLASH OR

PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL

NOT EXCEED 0.010mm PER SIDE.

5. DATUMS A AND B TO BE DETERMINED AT DATUM PLANE H.

DIM

MIN

MAX

MILLIMETERS

A

1.35

1.75

A1

−−−

0.10

A2

1.35

1.65

b

0.31

0.51

c

0.17

0.25

D

4.90 BSC

E

6.00 BSC

e

1.27 BSC

L

0.40

1.27

L1

1.04 REF

F

2.24

3.20

G

1.55

2.51

h

0.25

0.50

q

0

8

E1

3.90 BSC

_

_

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

7.00

1.27

1.52

8X

DIMENSIONS: MILLIMETERS

0.76

3.20

PITCH

2.51

8X

1

RECOMMENDED

C

0.10

D

E1

A

D

NOTE 5

14

5

8

D

E

B

TOP VIEW

8X

b

A-B

0.25

D

C

C

0.20

NOTE 4

C

0.10

D

NOTE 4

NOTE 5

D

NOTES 3

SEATING

PLANE

C

0.10

SIDE VIEW

C

A

A2

A1

e

BOTTOM VIEW

G

F

5

8

14

SEATING

PLANE

DETAIL A

L

(L1)

q

45 CHAMFER

5

H

C

h

END VIEW

c

DETAIL A

NOTE 7

SECTION A−A

b1

(b)

c

c1

A

A

PIN ONE

LOCATION

C

0.10

c1

0.17

0.23

b1

0.28

0.48