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AB178 Fiches technique(PDF) 5 Page - Lumileds Lighting Company |
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AB178 Fiches technique(HTML) 5 Page - Lumileds Lighting Company |
5 / 12 page AB178 LUXEON UV U Line Application Brief 20170620 ©2017 Lumileds Holding B.V. All rights reserved. 5 Figure 4. Do not touch the top of surface of the LUXEON UV U Line emitter when handling a finished board (a) or stack boards with one or more LUXEON UV U Line emitters on top of each other (b). 2. Printed Circuit Board (PCB) Design Guidelines The LUXEON UV U Line emitter is designed to be soldered onto a Metal Core PCB (MCPCB) or a ceramic PCB such as aluminum nitride (AlN). Table 1 shows the differences between these two PCB substrates. Table 1. MCPCB versus Ceramic PCB Comparison. MCPCB ALN CERAMIC PCB Cost Low High Coefficient of thermal expansion (CTE) Low CTE matching to LUXEON UV U Line High CTE matching to LUXEON UV U Line LED assembly packing density (thermal resistance consideration) Suitable for low density with larger LED to LED spacing Good for high density where LED to LED spacing may be as low as 200µm Mechanical assembly and handling Generally easy as board does not easily break Extra precaution to prevent ceramic breakage Solder mask and land pattern Need to use solder mask to define land pattern Land pattern can be defined by top copper layer, hence no solder mask degradation over time due to UV light To ensure optimal operation of the LUXEON UV U Line emitter, the PCB should be designed to minimize the overall thermal resistance between the LED package and the heat sink. 2.1 PCB Footprint and Land Pattern The LUXEON UV U Line emitter has two pads that need to be soldered onto corresponding pads on a PCB to ensure proper electrical operation. Figure 5 shows the recommended footprint designs for LUXEON UV U Line emitters. Figure 5. Recommended PCB Footprint for LUXEON UV U Line. NOTE: Solder mask degradation needs to be considered in the end product application requirement. |
Numéro de pièce similaire - AB178 |
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Description similaire - AB178 |
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