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TS3L301 Fiches technique(PDF) 3 Page - Texas Instruments

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No de pièce TS3L301
Description  16 BIT TO 8 BIT SPDT GIGABIT LAN SWITCH WITH LOW AND FLAT ON STATE RESISTANCE
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Fabricant  TI [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI - Texas Instruments

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TS3L301
16BIT TO 8BIT SPDT GIGABIT LAN SWITCH
WITH LOW AND FLAT ONSTATE RESISTANCE
SCDS178B − NOVEMBER 2004 − REVISED APRIL 2005
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VDD
−0.5 V to 4.6 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Control input voltage range, VIN (see Notes 1 and 2)
−0.5 V to 7 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Switch I/O voltage range, VI/O (see Notes 1, 2, and 3)
−0.5 V to 7 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Control input clamp current, IIK (VIN < 0)
−50 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I/O port clamp current, II/OK (VI/O < 0)
−50 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ON-state switch current, II/O (see Note 4)
±128 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VDD or GND terminals
±100 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance,
θJA (see Note 5): DGG package
70
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DGV package
58
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg
−65
°C to 150°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. All voltages are with respect to ground, unless otherwise specified.
2. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
3. VI and VO are used to denote specific conditions for VI/O.
4. II and IO are used to denote specific conditions for II/O.
5. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 6)
MIN
MAX
UNIT
VDD
Supply voltage
3
3.6
V
VIH
High-level control input voltage (SEL)
2
5.5
V
VIL
Low-level control input voltage (SEL)
0
0.8
V
VI/O
Input/output voltage
0
5.5
V
TA
Operating free-air temperature
−40
85
°C
NOTE 6: All unused control inputs of the device must be held at VDD or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.


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