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LTL42TG6NJLCH240 Fiches technique(PDF) 8 Page - Lite-On Technology Corporation

No de pièce LTL42TG6NJLCH240
Description  Through Hole Lamp
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Fabricant  LITEON [Lite-On Technology Corporation]
Site Internet  http://www.liteon.com.tw/databook/default.htm
Logo LITEON - Lite-On Technology Corporation

LTL42TG6NJLCH240 Fiches technique(HTML) 8 Page - Lite-On Technology Corporation

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Part No. : LTL42TG6NJLCH240
BNS-OD-FC002/A4
Through Hole Lamp
LTL42TG6NJLCH240
8. CAUTIONS
8.1. Application
This LED lamp is good for application of indoor and outdoor sign, also ordinary electronic equipment.
8.2. Storage
The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity. It is re commended that
LEDs out of their original packaging are used within three months. For extended storage out of their original packaging, it is
recommended that the LEDs be stored in a sealed container with appropriate desiccant or in desiccators with nitrogen
ambient.
8.3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary.
8.4. Lead Forming & Assembly
During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens. Do not use the base of the
lead frame as a fulcrum during forming. Lead forming must be done before soldering, at normal temperature. During assembly
on PCB, use minimum clinch force possible to avoid excessive mechanical stress.
8.5. Soldering
When soldering, leave a minimum of 2mm clearance from the base of the lens to the soldering point. Dipping the lens into the
solder must be avoided. Do not apply any external stress to the lead frame during soldering while the LED is at high
temperature.
Recommended soldering conditions:
Soldering iron
Wave soldering
Temperature
Soldering time
Position
350°C Max.
3 seconds Max.
(one time only)
No closer than 2mm
from the base of the epoxy bulb
Pre-heat
Pre-heat time
Solder wave
Soldering time
Dipping Position
120°C Max.
100 seconds Max.
260°C Max.
5 seconds Max.
No lower than 2mm from the
base of the epoxy bulb
Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic failure of the LED.
IR reflow is not suitable process for through hole type LED lamp product. Max temperature of wave soldering is not means
that Holder’s HDT/Melting temperature.
8.6. Drive Method
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an
application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each LED as
shown in Circuit A below.
Circuit model (A)
Circuit model (B)
LED
LED
(A) Recommended circuit
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics of those LEDs.


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