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TFA9842J Datasheet(Fiches technique) 18 Page - NXP Semiconductors

Numéro de pièce TFA9842J
Description  2-channel audio amplifier; SE: 1 W to 7.5 W; BTL: 2 W to 15 W
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Fabricant  PHILIPS [NXP Semiconductors]
Site Internet  http://www.nxp.com
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Philips Semiconductors
TFA9842J
2-channel audio amplifier (2 x SE or 1 x BTL)
Preliminary data
Rev. 01 — 26 April 2004
18 of 21
9397 750 12013
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
16. Soldering
16.1 Introduction to soldering through-hole mount packages
This text gives a brief insight to wave, dip and manual soldering. A more in-depth
account of soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of through-hole mount IC
packages on a printed-circuit board.
16.2 Soldering by dipping or by solder wave
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250
°C or 265 °C, depending on solder material applied, SnPb or
Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specified maximum storage temperature (Tstg(max)).
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
16.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300
°C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400
°C, contact may be up to 5 seconds.
16.4 Package related soldering information
[1]
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
[2]
For PMFP packages hot bar soldering or manual soldering is suitable.
Table 11:
Suitability of through-hole mount IC packages for dipping and wave
soldering methods
Package
Soldering method
Dipping
Wave
DBS, DIP, HDIP, RDBS, SDIP, SIL
suitable
suitable[1]
PMFP[2]
not suitable




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